Sweden – Industrial machinery – Deep Reaction Ion Etcher (DRIE)

Scope of work

Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.

Technical & administrative conditions

Verify all conditions in the official documents; eligibility has not been certified.

Documents

Assessment

Explainable rule score; eligibility is not guaranteed.

Items to verify

Verify all conditions in the official documents; eligibility has not been certified.

Published amount: Not supplied